Peregrine Semiconductor Corporation, a leading developer of high performance integrated circuits for the optical and wireless communications markets, today announced additional foundry capabilities to allow customers easy access to Peregrine’s patented Ultra-Thin-Silicon (UTSi¿) CMOS technology.
“With the growing demand for access to advanced semiconductor technology, this capability is a natural evolution in Peregrine’s expanding foundry business,” said Chuck Tabbert, director of space and defense products for Peregrine.
“Multi-project mask sets and wafer runs are standard practices in the semiconductor industry when developing new products. We are just expanding on the idea and allowing customers the same access that our internal design teams have.
“This allows our customers the opportunity to try new designs and keeps the cost of experimentation down,” Tabbert added.
According to Tabbert, for $20K, customers can schedule space on upcoming Peregrine-sponsored wafer runs and get IC’s back to help prove out their design concepts. Peregrine currently offers its 3 level metal 0.5uM Silicon-On-Sapphire (SOS) process for customer multi-project wafer fabrication. Peregrine’s technology roadmap evolves to a 0.25uM process in CY2002 and a 0.13uM in CY2003.
