Subscribe free to our newsletters via your
. 24/7 Space News .




TECH SPACE
New Simulation Tool Could Shorten Manufacturing Design Process
by Staff Writers
Blacksburg VA (SPX) Feb 03, 2010


File image.

Novel research on improving the simulation performance of hardware models created in a language called SystemC, often used to shorten manufacturing design cycles to improve the time it takes to bring a product to the marketplace, has garnered a best paper award at the 15th Asia and South Pacific Design Automation Conference (ASP-DAC) for a team led by Sandeep Shukla, Virginia Tech associate professor of electrical and computer engineering (ECE), and three of his students.

Shukla wrote the paper with his current Ph.D. students, Mahesh Nanjundappa and Bijoy A. Jose, also of Virginia Tech, and a past Ph.D. advisee Hiren D. Patel who is now an ECE assistant professor at the University of Waterloo in Canada.

Shukla and his collaborators said that they were able to demonstrate how to speed up the simulation performance of certain SystemC based hardware models "by exploiting the high degree of parallelism afforded by today's general purpose graphic processor units (GPGPU)." These units have multiple core processors capable of very high computation and data throughput.

When parallelism is applied, it means that the processor units can run various parts of the simulations simultaneously, and not just as a single sequence of computations. Their experiments were carried out on an NVIDIA Tesla 870 with 256 processing cores. This equipment was donated to Shukla's lab by NVIDIA during fall 2008.

Shukla said their preliminary experiments showed they were able to speed up SystemC based simulation by factors of 30 to 100 times that of previous performances.

They named their simulation infrastructure SCGPSim. The Air Force Office of Scientific Research and the National Science Foundation helped support this research.

In the past, Shukla said, "significant effort was aimed at improving the performance of SystemC simulations, but little had been directed at making them operate in parallel. And none of the attempts were ever targeted at a massively parallel platform such as a general purpose graphic processor unit."

Another aspect of their work was the use of a specific programming model called Compute Unified Device Architecture (CUDA). It is an extension to the C software language that "exploits the processing power of graphic processor units to solve complex compute-intensive problems efficiently," Shukla explained. "High performance is achieved by launching a number of threads and making each thread execute a part of the application in parallel."

The CUDA execution model differs from the more commonly known central processing unit (CPU) based execution in terms of how the threads are scheduled. With CUDA, it is possible to have all of the threads execute simultaneously on separate processor cores and intermittently converge on the same path, thus increasing the efficiency.

The work at Virginia Tech was conducted in the Formal Engineering Research with Models, Abstractions and Transformations (FERMAT) Laboratory, founded by Shukla in 2002. Its focus is in designing, analyzing and predicting performance of electronic systems, particularly systems embedded in automated systems. http://www.fermat.ece.vt.edu/

"Speeding up simulation of complex hardware models is extremely important for semiconductor electronics industry to producer newer and newer products in shorter times, thus improving the quality of computing and consumer electronics products faster. If such models can be simulated 10 times faster, then if validating a model took 10 days in the past, now it would take one day. This is why faster simulation performance probably attracted the attention of the ASP-DAC '10 awards committee." Shukla said.

.


Related Links
Virginia Tech
Space Technology News - Applications and Research






Comment on this article via your Facebook, Yahoo, AOL, Hotmail login.

Share this article via these popular social media networks
del.icio.usdel.icio.us DiggDigg RedditReddit GoogleGoogle








TECH SPACE
An Easy Way To See Thinnest Material
Evanston IL (SPX) Jan 04, 2010
It's been used to dye the Chicago River green on St. Patrick's Day. It's been used to find latent blood stains at crime scenes. And now researchers at Northwestern University have used it to examine the thinnest material in the world. The useful tool is the dye fluorescein, and Jiaxing Huang, assistant professor of materials science and engineering at the McCormick School of Engineering an ... read more


TECH SPACE
Seed Bank For The Moon

Obama to propose abandoning US return to Moon: report

NASA Adds Israeli Technical Expertise To Lunar Science Research

PVAMU Scientists Add "Moon Mud" To Lunar Radiation Shielding Studies

TECH SPACE
A Stationary Spirit

Spirit Bogged In Sand: Now A Stationary Research Platform

Close Encounter With Mars

Spirit rover to remain stuck in Martian sand

TECH SPACE
CSF Comments On NASA Commercial Crew Program And Budget Increase

Obama trims US space ambitions

Feeding Our Future On Earth And In Space

Alternate Space Capsule Concept Passes Tests

TECH SPACE
UK's First China Space Race Exhibition Launched

No Spacewalk From Tiangong-1

China's Mystery Spacelab

China launches orbiter for navigation system: state media

TECH SPACE
NASA Provides Inside Look At ISS With Streaming Video

Endeavour to bring high-tech 'sunroom' to ISS

Russian Specialists Raise ISS Orbit

Robotic Capture And Mating Of Orbital's Cygnus Cargo Delivery Spacecraft To ISS

TECH SPACE
Arianespace Wins ESA Contract

SpaceX And Spacecom Sign Contract

Arianespace To Launch The First Ten Galileo Satellites

Activities At Esrange Space Center 2010

TECH SPACE
NASA's Rosetta "Alice" Spectrometer Reveals Earth's UV Fingerprint

Make A Play Date With Planet Explorers At The Adler

VLT Captures First Direct Spectrum Of An Exoplanet

Alien Planet Safari

TECH SPACE
New Simulation Tool Could Shorten Manufacturing Design Process

Amazon, Macmillan in public tussle over e-book prices

Ball Aerospace Begins Integration Of VIIRS For NPOESS

Northrop Grumman Provides Microelectronics For ESA Spacecraft




The content herein, unless otherwise known to be public domain, are Copyright 1995-2014 - Space Media Network. AFP, UPI and IANS news wire stories are copyright Agence France-Presse, United Press International and Indo-Asia News Service. ESA Portal Reports are copyright European Space Agency. All NASA sourced material is public domain. Additional copyrights may apply in whole or part to other bona fide parties. Advertising does not imply endorsement,agreement or approval of any opinions, statements or information provided by Space Media Network on any Web page published or hosted by Space Media Network. Privacy Statement