Peregrine Ready To Pound Out Space Chips

TECH SPACE

As space missions become ever more demanding the need for higher quality electronics will only increase in importance

San Diego - July 12, 2001
Peregrine Semiconductor Corporation, a leading developer of high performance integrated circuits for the optical and wireless communications markets, today announced additional foundry capabilities to allow customers easy access to Peregrine's patented Ultra-Thin-Silicon (UTSiďż˝) CMOS technology.

"With the growing demand for access to advanced semiconductor technology, this capability is a natural evolution in Peregrine's expanding foundry business," said Chuck Tabbert, director of space and defense products for Peregrine.

"Multi-project mask sets and wafer runs are standard practices in the semiconductor industry when developing new products. We are just expanding on the idea and allowing customers the same access that our internal design teams have. "This allows our customers the opportunity to try new designs and keeps the cost of experimentation down," Tabbert added.

According to Tabbert, for $20K, customers can schedule space on upcoming Peregrine-sponsored wafer runs and get IC's back to help prove out their design concepts. Peregrine currently offers its 3 level metal 0.5uM Silicon-On-Sapphire (SOS) process for customer multi-project wafer fabrication. Peregrine's technology roadmap evolves to a 0.25uM process in CY2002 and a 0.13uM in CY2003.

SPACEMART

SEAKR Offers Compact Flash Memory Pak For Space Applications

Englewood - July 16, 2001
SEAKR Engineering, Incorporated announced today the availability of its NV-CPCI Non-volatile, Solid State Flash Memory product family. Currently available product consists of two versions: a space qualified and an "Other Than Space" version. According to SEAKR officials, the two configurations complement both space and "Other Than Space" applications.

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