. | . |
New bimetallic alloy nanoparticles for printed electronic circuits by Staff Writers Toyohashi, Japan (SPX) Jan 07, 2016
"Printed electronics" has the potential to enable low-cost fabrication of electronics on flexible or curved surfaces, which will lead to the use of electronics in more varied applications. We will be able to fabricate homemade mobile phones or smart watches using a printer in the future. However, the low performance and high cost of current conductive inks limit the advancement of printed electronics. Now, researchers at Toyohashi Tech and Duke University have found a way to produce new copper alloy nanoparticles, which can be used as the main component of affordable conductive inks with high oxidation resistance. The researchers electrically exploded alloy or twisted metal wires in water with a mild reducing agent (Vitamin C) in order to produce the nanoparticles. The reduction in conductivity was subsequently measured under harsh conditions (high temperature and high humidity). "We have been working on developing a 'wire explosion' method to produce novel metal nanoparticles. Then, we found that some of the produced copper alloy nanoparticles possessed both high oxidation resistance and low electrical resistance," explains Assistant Professor Go Kawamura. "Moreover, the nanoparticles have the advantage of being inexpensive because the production process is very economical and environmentally friendly." As a result, copper nanoparticles alloyed with 1% Sn, 5% Ag, 5% Ni, or 30% Ni had electrical conductivities similar to that of copper; however, unlike copper, the nanoparticles remained conductive after 24 h at 85 C and 85% relative humidity. With further improvement of the electrical conductivity and oxidation resistance, copper alloy nanoparticles prepared by wire explosion could be used for the production of high-performance affordable conductive inks, which will contribute to the advancement of printed electronics. The researchers also hope this work motivates additional study of combining wire explosion with chemical modification of the explosion medium to control the composition and surface chemistry of nanoparticles. Go Kawamura, Samuel Alvarez, Ian E. Stewart, Matthew Catenacci, Zuofeng Chen and Yoon-Cheol Ha (2015). Production of oxidation-resistant Cu-based nanoparticles by wire explosion, Scientific Reports, 5:18333, 1-8. 10.1038/srep18333
Related Links Toyohashi University of Technology Computer Chip Architecture, Technology and Manufacture Nano Technology News From SpaceMart.com
|
|
The content herein, unless otherwise known to be public domain, are Copyright 1995-2024 - Space Media Network. All websites are published in Australia and are solely subject to Australian law and governed by Fair Use principals for news reporting and research purposes. AFP, UPI and IANS news wire stories are copyright Agence France-Presse, United Press International and Indo-Asia News Service. ESA news reports are copyright European Space Agency. All NASA sourced material is public domain. Additional copyrights may apply in whole or part to other bona fide parties. All articles labeled "by Staff Writers" include reports supplied to Space Media Network by industry news wires, PR agencies, corporate press officers and the like. Such articles are individually curated and edited by Space Media Network staff on the basis of the report's information value to our industry and professional readership. Advertising does not imply endorsement, agreement or approval of any opinions, statements or information provided by Space Media Network on any Web page published or hosted by Space Media Network. General Data Protection Regulation (GDPR) Statement Our advertisers use various cookies and the like to deliver the best ad banner available at one time. All network advertising suppliers have GDPR policies (Legitimate Interest) that conform with EU regulations for data collection. By using our websites you consent to cookie based advertising. If you do not agree with this then you must stop using the websites from May 25, 2018. Privacy Statement. Additional information can be found here at About Us. |